TMYTEK has introduced a one-stop AiP (Antenna in Package) design service to fulfill different antenna system requirements for various applications, from the ground, maritime, and air communication. The design capabilities support SATCOM, 5G/B5G to 6G that covers a mmWave GHz and higher frequencies, and antenna elements from small scale 8x8 to large 64x64 matrix solutions. It offers well-balanced high EIRP performances, thermal, and compact size in one solid tile-based design. Contributed by the deep-dive ecosystem collaboration, TMYTEK’s design is one of the best choices for the best cost-effective and time-efficient solution for essential performance.

Applications for AiP

5G O-RAN RU

mmWave is the key technology in offering ultra-high network capacity. The mmWave fronthaul is designed within the moveable radio unit (RU) or integrated into the macro/small cell that includes a distributed unit (DU)/centralized unit (CU) for flexible deployment. And the phased array antenna is the solution for compensating the path loss of the mmWave band and applying it to beamforming and MIMO systems to fulfill application requirements to guarantee user experiences. TMYTEK AiP system offers the total solution for 5G O-RAN RU from antenna beamformer, frequency up/down converter to Low-PHY integration

Key Features and Benefits:
• 5G FR2 band support - n257, n258, n261
• 8x8 tile-based and dual-polarization
• IF/IQ mode ready
• Ultra-High EIRP

SATCOM Terminal

Low Earth Orbit (LEO) satellite means it is close to the Earth with low latency and higher throughput features, it would revolutionize the internet services. Its signal travels so fast and to track from the ground terminal requires effort. TMYTEK’s AiP solution evaluated the high EIRP large antenna array for quick prototyping, and it is also capable of low latency beam steering and tile design features to benefit the user terminal performance.

Key Features and Benefits:
• Ku-band/Ka-band support and L band (IF) ready
• 8x8, 16x16 tile-based and H/V & circular polarization
• ACU (Antenna Control Unit) for tracking satellites
• LTCC process know-how from material to manufacture
• Commercial and defense ready
• Extreme weather resistant

Covered Frequency and Application

AiP is needed for mmWave

Reduce path loss

In the 5G mmWave RF module, the antenna must be close to the beamforming circuit as much as possible to reduce the path losses. Antenna-in-Package (AiP) technology turns into an elegant solution.

Size and Cost

5G NR mmWave base station and small cell care about the dimension and the size of the device. AiP provides a very compact form factor to be acted as an RU in gNB.

Antenna to ORAN

TMYTEK is offering 3 types of packaging that fulfill the requirement in developing the products,

PCB. 8X8 IF-ready

8x8 PCB-based AiP with mixer and doubler. RF complies with 5G n261 band IF is 3-5 GHz. 12 layers of PCB with a customizable thickness of each layer for performance optimization. A larger array can be formed by repeating multiple unit modules.

LTCC. 16X16. L Band Ready

ESA technology promises the ramp-up of LEO/ multilayered ground terminals. TMYTEK has extensive experience and resources in Ku/Ka band ESA/PAA design, verification, and manufacturing. With the successful LTCC process, the system provides high stable performance such as the ability to operate in extreme weather conditions with outstanding heat dissipation performance, coefficient of thermal expansion (CTE) match to bare die, and zero moisture absorption.

LTCC. 26 layers

TMYTEK worked with a Japanese Low-Temperature Cofired Ceramic (LTCC) technology company to realize a 4x4 unit AiP module. A 26 layers design integrates 4x4 slot antenna elements and 4 beamforming chips. A mixer and multiplier chips are also included to build an IF-ready module.